Jedec tray standard pdf

Jedec tray standard pdf
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the outline dimensions of all jedec matrix trays are 12.  25 from ” - to 0.  registration or login required.  standard - thin matrix tray for handling and shipping plcc packages.  jedec matrix ic trays.  inquiries, comments, and suggestions relative to the content of this jedec standard jedec tray standard pdf or publication should be addressed to jedec at the address below, or callor www.  qfp, lqfp, tqfp tray jedec matrix ic trays qfp, lqfp, tqfp ic matrix trays conform to jedec standards qfp body size quantity pockets per tray matrix row- column jedec reference order topline part number qfp ( mqfp) tray 10 x 10mm 96 6 x 16 cs- 004aa qtray10mm- 6x16 14 x 14mm 84 6 x 14 cs- 004ab qtray14mm- 6x14 14 x 20mm 66 6 x 11 cs- 004ac.  eiaj standard for fbga trays ( jc- 11.  * 1: the size of the outer box may be changed depending on the quantity of inner boxes.  jedec standard trays are strong, with minimum twist, to hold and protect its contents.  for assistance, send the component manufacturer datasheet to topline.  carrier standards ( cs) contents.  tray reference symbol 3.  jedec publication no.  trays are stacked and bound together to form standard packing configurations.  moved permanently.  the document has moved here.  * 4: the packing materials except tray may differ slightly from the color and dimensions depend on.  variations aa- al.  qfn ic matrix trays conform to jedec standards.  2 mm in thickness.  cs- 001 metric tab magazine family cs- 002 thin matrix tray for handling and shipping of pqfp cs- 003 thin matrix tray for handling and shipping of plcc packages cs- 004 thin matrix tray for handling and shipping of fqfp/ mqfp.  published by © jedec solid state technology associationnorth 10th street, suite 240 south arlington, va 22201.  guidelines for packing and labeling of integrated circuits in unit container packing ( tubes, trays, and tape and reel) jep130c.  jep95 registrations main page.  package material information.  ( 7) the dimension “ w3- w 2” and “ l4- l 3” were changed “ 0.  35mm) accommodate 90% of all standard components, such as bga, csp, qfp, tqfp, qfn, tsop and soic.  trays are bakeable up to 150oc and can be reused without any cracking or defects to the tray for up to five 24- hour bake cycles.  this document establishes guidelines for integrated circuit unit container and the next level ( intermediate) container packing and labeling.  quantity pockets per tray.  4mm thickness tray.  qfp ( mqfp) tray.  of tray circuit ” are proceded.  * 2: the space in the outer box will be filled with empty inner boxes, or cushions, etc.  the guidelines include tube/ rail standardization, intermediate packing, date codes, tube labeling, intermediate container and shipping labels, and standardize tube quantities.  joint ipc/ jedec tray standard pdf jedec standard for handling, packing, shipping, and use of moisture/ reflow sensitive surface- mount devices.  quantity pockets per tray qfn tray.  pdf these heat- resistant trays are not only more rigid, but they endure baking at 125° c, which is the recommended temperature for dehydrating moisture- sensitive devices.  these changes will be.  design requirements - generic matrix tray for handling and shipping, includes addition of optional side- wall bar code feature.  new terms will be defined in the descriptions of this standard.  note 3: up to five jedec trays may be stacked with empty tray on top as a cover.  sll uses only standard jedec tray configurations.  jedec- compliant industry standard trays are used for qfp, bga, and pga semiconductors.  89 ” by the review of tray design guide.  ( 6) when we need to make a new tray, 1, we 1, l 2, w shall 2, l 3 land use s pdf in the recommended value eiaj which edr- 7602 is standard.  joint ipc/ jedec standard for handling, packing, shipping, and use of moisture/ reflow sensitive surface- mount devices: j- std- 033d : joint ipc/ jedec standard moisture/ reflow sensitivity classification for non- hermetic surface mount devices ( smds) j- std- 020f : preconditioning of nonhermetic surface mount devices prior to reliability testing.  cs- 003- b apr 1993: committee( s) : jc- 11, jc- 11.  future revisions of this document will also include tray and reel guidelines.  * 3: please refer to an attached sheet about the indication label.  committee ( s) : jc- 11, jc- 11.  fbga matrix tray design for shipping and handling) to the eia/ jedec, but this proposal was rejected by a vote of 7 to 7 with 8 abstentions at the jc- 11.  1 structure of tray reference symbols in this standard, the structure of tray reference symbols is defined as follows.  the tray is designed for components that have leads on four sides ( qfp and tqfp packages) and require component lead isolation during shipping, handling, or processing.  5mm with end tabs) note 2: standard tray color: black conductive or dissipative molding compound esd safe.  qfp, lqfp, tqfp ic matrix trays conform to jedec standards.  symbol of qfp tray symbol of qfp types symbol of reference symbol qfp outline dimensions 3.  note 1: jedec standard outline 136 x 315mm ( 322.  5 meeting held in october, 1998.  after then, the eia/ jedec proposed a design guideline for fbga packages of up to pdf 1.  all the full- size jedec trays used by intel® can withstand temperatures of at least 150° c, or you can also refer to the maximum rated temperature marked on each tray.  low profile trays with thickness of 0.